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SCT4062KEHRC11 - ROHM Semiconductor

Description: Qualified to AEC-Q101 Low on-resistance ) Fast switching speed

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SCT4062KEHRC11 - ROHM Semiconductor - PCB symbol
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PCB Footprints
SCT4062KEHRC11 - ROHM Semiconductor PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - SCT3160KLHRC11
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3D Models
SCT4062KEHRC11 - ROHM Semiconductor - 3D model - Transistor Outline, Vertical - SCT3160KLHRC11
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SCT4062KEHRC11 Details

  • Manufacturer Part Number:

    SCT4062KEHRC11

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    27 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    8

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    1200 V

  • Drain Current-Max (ID):

    26 A

  • Drain-source On Resistance-Max:

    0.081 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    3 pF

  • JEDEC-95 Code:

    TO-247

  • JESD-30 Code:

    R-PSFM-T3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    52 A

  • Reference Standard:

    AEC-Q101

  • Surface Mount:

    NO

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON CARBIDE

SCT4062KEHRC11 Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended.
  • Ensure that the device is operated within the recommended temperature range (TJ = -40°C to 150°C). Use a heat sink or thermal interface material to reduce thermal resistance. Also, consider derating the device's power dissipation at high temperatures.
  • ROHM recommends a soldering profile with a peak temperature of 260°C, a dwell time of 10-30 seconds, and a temperature slope of 3°C/s. Refer to the ROHM soldering guidelines for more information.
  • The SCT4062KEHRC11 is not hermetically sealed, so it's not recommended for use in high-humidity environments. If you must use it in such an environment, consider applying a conformal coating to protect the device from moisture.
  • Store the device in a dry, cool place (temperature: 5°C to 30°C, humidity: 60% or less). Avoid storing the device in direct sunlight or near heat sources.

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SCT4062KEHRC11 Overview

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