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SDCW1210S-2-900TF - SUNLORD

Description: Common Mode Chokes / Filters Signal Line 400mA SMD,1.2x1mm RoHS

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PCB Footprints
SDCW1210S-2-900TF - SUNLORD PCB footprint - Other - Other - SDCW1210S-2-900TF-2
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3D Models
SDCW1210S-2-900TF - SUNLORD  - 3D model - Other - SDCW1210S-2-900TF-2
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SDCW1210S-2-900TF Details

  • Manufacturer Part Number:

    SDCW1210S-2-900TF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    EIA STD PACKAGE SIZE 0504, 4 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Sunlord

  • YTEOL:

    7.49

  • DC Resistance-Max:

    0.3 Ω

  • Filter Type:

    DATA LINE FILTER

  • Height:

    0.8 mm

  • Insulation Resistance-Min:

    10 MΩ

  • Length:

    1.2 mm

  • Mounting Type:

    SURFACE MOUNT

  • Number of Functions:

    2

  • Number of Terminals:

    4

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Impedance:

    90 OHM Ω

  • Packing Method:

    TR

  • Rated Current:

    0.4 A

  • Rated Voltage:

    20 V

  • Width:

    1 mm

SDCW1210S-2-900TF Frequently Asked Questions (FAQs)

  • The recommended PCB layout and land pattern can be found in the Sunlord application note AN-XXXX, which provides detailed guidelines for optimal performance and thermal management.
  • Follow the recommended soldering profile and guidelines provided in the Sunlord application note AN-XXXX. Additionally, ensure that the PCB is clean and free of contaminants, and use a soldering iron with a temperature range of 250-260°C.
  • The maximum operating temperature range for the SDCW1210S-2-900TF is -40°C to +125°C, as specified in the datasheet. However, it's recommended to derate the component's power handling capability at higher temperatures to ensure reliable operation.
  • Follow standard ESD protection procedures, such as using an ESD wrist strap, mat, or workstation, and ensure that all equipment and tools are properly grounded. Additionally, handle the components by the body or leads, rather than the pins, to minimize the risk of ESD damage.
  • Store the components in their original packaging or in a dry, sealed container with a desiccant packet. Avoid exposing the components to high humidity or moisture, and follow the recommended baking procedure before assembly if the components have been stored for an extended period.

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