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SDE0403A-6R8M - Bourns

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SDE0403A-6R8M Details

  • Manufacturer Part Number:

    SDE0403A-6R8M

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    1616

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.126 Ω

  • Inductance-Nom (L):

    6.8 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    3.2 mm

  • Package Length:

    4 mm

  • Package Style:

    SMT

  • Package Width:

    4 mm

  • Packing Method:

    TR, Embossed , 13 Inch

  • Rated Current-Max:

    1.45 A

  • Reference Standard:

    AEC-Q200

  • Self Resonance Frequency:

    41 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    1 MHz

  • Tolerance:

    20%

SDE0403A-6R8M Frequently Asked Questions (FAQs)

  • The recommended PCB layout for the SDE0403A-6R8M includes a ground plane underneath the device, and keeping the input and output traces as short as possible to minimize parasitic inductance and capacitance. Additionally, it's recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane to reduce noise and EMI.
  • The SDE0403A-6R8M has a maximum operating temperature of 125°C. To ensure reliable operation, it's essential to provide adequate heat sinking and thermal management. This can be achieved by using a thermal pad or a heat sink, and ensuring good airflow around the device. Additionally, the device's power rating should not be exceeded, and the ambient temperature should be kept below 85°C.
  • The recommended soldering process for the SDE0403A-6R8M is a reflow soldering process with a peak temperature of 260°C. The device is also compatible with wave soldering, but the temperature should not exceed 240°C. It's essential to follow the recommended soldering profile and to avoid overheating the device to prevent damage.
  • To ensure the reliability and longevity of the SDE0403A-6R8M, it's essential to operate the device within its recommended specifications, avoid overheating, and provide adequate power supply decoupling. Additionally, the device should be handled and stored in a clean, dry environment, and should not be subjected to mechanical stress or vibration.
  • The SDE0403A-6R8M has built-in ESD protection, but it's still essential to take precautions during handling and assembly to prevent ESD damage. This includes using ESD-safe materials, grounding personnel and equipment, and using ESD-protective packaging and storage.

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SDE0403A-6R8M Overview

Use the download button to access the SDE0403A-6R8M 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SDE04, or try a keyword search, such as Fixed Inductors

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