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SDM2U20CSP-7 - Diodes Incorporated

Description: Diodes Inc SDM2U20CSP-7, SMT Schottky Barrier Diode, 20V 2A, 2-Pin X3-WLB1608

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SDM2U20CSP-7 - Diodes Incorporated PCB footprint - Other - Other - SDM2U20CSP
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SDM2U20CSP-7 - Diodes Incorporated  - 3D model - Other - SDM2U20CSP
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SDM2U20CSP-7 Details

  • Manufacturer Part Number:

    SDM2U20CSP-7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    GREEN, COMPACT, X3-WLB1608-2, CSP-2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Diodes Incorporated

  • YTEOL:

    5

  • Additional Feature:

    LOW LEAKAGE CURRENT

  • Application:

    EFFICIENCY

  • Case Connection:

    ANODE

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    0.47 V

  • JESD-30 Code:

    R-XBCC-N2

  • JESD-609 Code:

    e4

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    20 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Output Current-Max:

    2 A

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    CHIP CARRIER

  • Peak Reflow Temperature (Cel):

    260

  • Power Dissipation-Max:

    0.83 W

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Reverse Current-Max:

    150 µA

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    Nickel/Gold (Ni/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

SDM2U20CSP-7 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for SDM2U20CSP-7 is a 2.5mm x 2.5mm QFN package with a 0.5mm pitch. A minimum of 4-layer PCB is recommended to ensure optimal thermal performance.
  • To ensure reliable operation in high-temperature environments, ensure proper thermal management by providing adequate heat sinking, using thermal interface materials, and following the recommended PCB design guidelines. Additionally, consider derating the device's power handling capabilities according to the temperature derating curve provided in the datasheet.
  • The SDM2U20CSP-7 has built-in ESD protection diodes on all pins, which can withstand up to ±2kV HBM (Human Body Model) and ±200V MM (Machine Model) ESD events. To prevent latch-up, ensure that the device is operated within the recommended operating conditions, and avoid applying voltage or current exceeding the maximum ratings.
  • Yes, the SDM2U20CSP-7 is suitable for high-frequency switching applications up to 100kHz. However, ensure that the device is operated within the recommended frequency range and that the PCB design is optimized for high-frequency operation, including proper decoupling, grounding, and layout considerations.
  • The optimal gate resistor value for SDM2U20CSP-7 depends on the specific application requirements, including the switching frequency, voltage, and current. As a general guideline, a gate resistor value between 10Ω to 100Ω is recommended. However, it's essential to perform simulations and experiments to determine the optimal value for your specific application.

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SDM2U20CSP-7 Overview

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