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SDR0302-2R2ML - Bourns

Description: 2.2 µH Unshielded Drum Core, Wirewound Inductor 1.65 A 90mOhm Max Nonstandard

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Symbol
SDR0302-2R2ML - Bourns - PCB symbol
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PCB Footprints
SDR0302-2R2ML - Bourns PCB footprint - Other - Other - SDR0302-2R2ML-4
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3D Models
SDR0302-2R2ML - Bourns - 3D model - Other - SDR0302-2R2ML-4
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SDR0302-2R2ML Details

  • Manufacturer Part Number:

    SDR0302-2R2ML

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    1211

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.09 Ω

  • Inductance-Nom (L):

    2.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e2

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    2.5 mm

  • Package Length:

    3 mm

  • Package Style:

    SMT

  • Package Width:

    2.8 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    1.65 A

  • Self Resonance Frequency:

    75 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    SILVER NICKEL TIN

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SDR0302-2R2ML Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SDR0302-2R2ML can be found in the Bourns Application Note S-8151, which provides guidelines for PCB layout and land pattern design.
  • The SDR0302-2R2ML has a maximum operating temperature of 150°C. To ensure reliable operation, it's essential to consider thermal management, such as providing adequate heat sinking, using thermal vias, and optimizing PCB layout to minimize thermal resistance.
  • The recommended soldering profile for the SDR0302-2R2ML is a peak temperature of 260°C for 10-15 seconds, with a ramp-up rate of 3°C/second and a ramp-down rate of 6°C/second. This profile ensures reliable solder joints and minimizes thermal stress.
  • Yes, the SDR0302-2R2ML is designed to withstand high-vibration environments. However, it's essential to ensure that the component is properly secured to the PCB using a suitable adhesive or mechanical fastening method to prevent mechanical stress and damage.
  • To ensure reliability in humid environments, it's essential to apply a conformal coating to the PCB and components. Additionally, consider using a moisture-resistant coating or potting compound to protect the component from moisture ingress.

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SDR0302-2R2ML Overview

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