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SDR0403-181KL - Bourns

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SDR0403-181KL - Bourns  - 3D model
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SDR0403-181KL Details

  • Manufacturer Part Number:

    SDR0403-181KL

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    5.7

  • Case/Size Code:

    1816

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    3.9 Ω

  • Inductance-Nom (L):

    180 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e1

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    3.2 mm

  • Package Length:

    4.5 mm

  • Package Style:

    SMT

  • Package Width:

    4 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    0.24 A

  • Self Resonance Frequency:

    5 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN SILVER COPPER

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    ONE SURFACE

  • Test Frequency:

    0.001 MHz

  • Tolerance:

    10%

SDR0403-181KL Frequently Asked Questions (FAQs)

  • The recommended land pattern for SDR0403-181KL is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While SDR0403-181KL is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the user should evaluate the component's performance under high-temperature conditions and ensure it meets the application's requirements.
  • SDR0403-181KL is a moisture-sensitive device (MSD) and requires proper handling and storage to prevent damage. It's essential to follow the recommended storage and handling procedures, such as storing the components in a dry, nitrogen-filled environment, and baking them before reflow soldering if they have been exposed to moisture.
  • The recommended soldering profile for SDR0403-181KL is a reflow soldering process with a peak temperature of 260°C, a dwell time above 220°C of 20-30 seconds, and a ramp rate of 3°C/second. It's essential to follow the recommended soldering profile to ensure proper soldering and minimize the risk of component damage.
  • While SDR0403-181KL is a robust component, it's essential to evaluate its performance under high-vibration or high-shock conditions. The user should consider the component's mechanical stress limits and ensure that it meets the application's requirements. Additional testing and validation may be necessary to ensure the component's reliability in such environments.

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SDR0403-181KL Overview

Use the download button to access the SDR0403-181KL 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SDR04, or try a keyword search, such as Fixed Inductors

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