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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SDR0403-271KL
- Part Number SDR0403-271KL
- Manufacturer Bourns
- Last Modified Date Jun 23, 2026 6:32 PM UTC
- Pinout / Pin List Click Here (Member Only)
SDR0403-271KL Details
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Manufacturer Part Number:
SDR0403-271KL
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
12 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
5.7
SDR0403-271KL Frequently Asked Questions (FAQs)
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The recommended land pattern for SDR0403-271KL is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
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While SDR0403-271KL is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the user should evaluate the component's performance and reliability under high-temperature conditions.
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To minimize the risk of moisture-related issues, it's recommended to store SDR0403-271KL in a dry environment (less than 30% relative humidity) and follow proper handling and packaging procedures. Baking the components before reflow soldering can also help to remove any absorbed moisture.
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A typical reflow soldering profile for SDR0403-271KL is a peak temperature of 260°C, with a dwell time of 20-30 seconds above 220°C. However, it's essential to consult the datasheet and follow the recommended soldering profile to ensure reliable assembly.
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While SDR0403-271KL is designed to be robust, it's crucial to evaluate the component's performance under vibration and shock conditions. The user should consider the component's mechanical stress limits and ensure that it is properly secured to the PCB to prevent mechanical failure.
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SDR0403-271KL Overview
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