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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SDR0703-471KL
- Part Number SDR0703-471KL
- Manufacturer Bourns
- Pin Count 2
- Part Category Inductor
- Package Category Other
- Last Modified Date Apr 10, 2024 8:41 AM UTC
- Pinout / Pin List Click Here (Member Only)
SDR0703-471KL Details
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Manufacturer Part Number:
SDR0703-471KL
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
12 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
5.7
SDR0703-471KL Frequently Asked Questions (FAQs)
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Bourns provides a recommended PCB land pattern in their application note AN204, which can be found on their website. The recommended land pattern ensures proper soldering and thermal management.
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Bourns recommends following their application note AN205 for designing and assembling the SDR0703-471KL in high-vibration environments. This includes using a secure mounting method, such as screwing or adhesive, and ensuring the PCB is properly secured to the chassis.
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While the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to note that the device's performance may degrade at extreme temperatures. For optimal performance, it's recommended to operate the SDR0703-471KL within a temperature range of -20°C to 100°C.
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The SDR0703-471KL is not designed for use in humid or wet environments. It's recommended to use a conformal coating or potting compound to protect the device from moisture, and to follow proper design and assembly guidelines to prevent water ingress.
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Bourns recommends storing the SDR0703-471KL in its original packaging, away from direct sunlight, moisture, and extreme temperatures. When handling the device, it's essential to follow proper ESD precautions, such as using an ESD wrist strap or mat, to prevent damage.
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SDR0703-471KL Overview
Use the download button to access the SDR0703-471KL 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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