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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SDR1305-101K
- Part Number SDR1305-101K
- Manufacturer Bourns
- Last Modified Date Mar 26, 2025 1:32 PM UTC
- Pinout / Pin List Click Here (Member Only)
SDR1305-101K Details
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Manufacturer Part Number:
SDR1305-101K
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
18 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
6.9
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Case/Size Code:
5050
SDR1305-101K Frequently Asked Questions (FAQs)
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Bourns provides a recommended PCB layout and land pattern in their application note AN164, which can be found on their website. It's essential to follow these guidelines to ensure proper performance and reliability of the device.
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The SDR1305-101K has a maximum operating temperature of 125°C. To ensure reliable operation, it's crucial to provide adequate heat sinking and thermal management. Bourns recommends using a thermal pad or heat sink with a thermal conductivity of at least 1 W/m-K. Additionally, ensure that the PCB layout allows for good airflow and heat dissipation.
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Bourns recommends following the JEDEC J-STD-020D.1 standard for soldering the SDR1305-101K. This standard outlines the recommended temperature profile, soldering time, and other parameters to ensure reliable solder joints.
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The SDR1305-101K is designed to withstand moderate vibration levels. However, if your application involves high-vibration environments, it's recommended to consult with Bourns' application engineers to discuss specific requirements and potential customization options.
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Bourns provides EMC-related information in their datasheet, but it's essential to consult with their application engineers to discuss specific EMC requirements and ensure the device meets your application's needs. Additionally, consider conducting EMC testing and simulation to validate the device's performance in your specific application.
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SDR1305-101K Overview
Use the download button to access the SDR1305-101K 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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