Bourns recommends a symmetrical PCB layout with a solid ground plane, and keeping the component away from high-frequency noise sources. A minimum of 2 oz copper thickness is recommended for the PCB.
The SDR1305-151K has a built-in shield to reduce EMI and RFI. Additionally, the device's compact size and low profile help to minimize radiation and susceptibility to external noise.
The SDR1305-151K is rated for operation from -40°C to +125°C, but derating is required above 85°C. Consult the datasheet for specific derating curves.
Yes, the SDR1305-151K is designed to withstand high-vibration and high-shock environments. It meets the requirements of IEC 60068-2-27 and IEC 60068-2-6 for vibration and shock, respectively.
Yes, the SDR1305-151K is compatible with lead-free soldering processes and meets the requirements of IPC/J-STD-020D for lead-free solderability.
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SDR1305-151K Overview
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