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SDR7045-220M - Bourns

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SDR7045-220M - Bourns  - 3D model
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SDR7045-220M Details

  • Manufacturer Part Number:

    SDR7045-220M

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Case/Size Code:

    2828

  • Construction:

    Rectangular

  • Core Material:

    FERRITE

  • DC Resistance:

    0.125 Ω

  • Inductance-Nom (L):

    22 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Height:

    4.5 mm

  • Package Length:

    7 mm

  • Package Style:

    SMT

  • Package Width:

    7 mm

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Rated Current-Max:

    1.4 A

  • Self Resonance Frequency:

    18 MHz

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    NO

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

SDR7045-220M Frequently Asked Questions (FAQs)

  • A symmetrical layout with a solid ground plane and minimal track length is recommended. Keep the input and output tracks separate and avoid crossing them to minimize noise and crosstalk.
  • Ensure proper thermal management by providing adequate heat sinking and airflow. Also, follow the recommended derating guidelines for temperature and voltage to prevent overheating and premature failure.
  • The maximum allowable voltage stress is 1.5 times the rated voltage (330V) for a maximum of 100ms. Exceeding this may cause permanent damage to the device.
  • Yes, but additional testing and validation may be required to meet specific industry standards (e.g., AEC-Q200 for automotive or IEC 62368-1 for industrial). Consult with Bourns Inc. or a qualified reliability engineer for guidance.
  • Use a thermal imaging camera to identify hotspots, and check for proper PCB layout, component selection, and soldering quality. Consult the datasheet and application notes for troubleshooting guidelines and contact Bourns Inc. support if needed.

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SDR7045-220M Overview

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