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SE050C2HQ1/Z01SDZ - NXP

Description: Security ICs / Authentication ICs ECC, RSA, AES, 3DES, MIFARE KDF, CL-IF, I<sup>2</sup>C Master

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PCB Footprints
SE050C2HQ1/Z01SDZ - NXP PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - HX2QFN20*-*-
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3D Models
SE050C2HQ1/Z01SDZ - NXP  - 3D model - Quad Flat No-Lead - HX2QFN20*-*-
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SE050C2HQ1/Z01SDZ Details

  • Manufacturer Part Number:

    SE050C2HQ1/Z01SDZ

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Not Recommended

  • Package Description:

    QFN-20

  • ECCN Code:

    5A992

  • HTS Code:

    8542.31.00.01

  • Factory Lead Time:

    13 Weeks

  • Manufacturer:

    NXP Semiconductors

  • YTEOL:

    3

  • JESD-30 Code:

    S-PQCC-N20

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC20,.12SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.33 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.62 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3 mm

  • uPs/uCs/Peripheral ICs Type:

    CRYPTOGRAPHIC AUTHENTICATOR

SE050C2HQ1/Z01SDZ Frequently Asked Questions (FAQs)

  • NXP provides a recommended PCB layout and thermal management guidelines in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, reliability, and thermal management. Additionally, consider using thermal vias, thermal pads, and heat sinks to dissipate heat effectively.
  • NXP provides a Secure Boot and Secure Firmware Update solution for the SE050C2HQ1. Implementing secure boot involves using the device's built-in secure boot mechanism, which verifies the authenticity and integrity of the firmware. For secure firmware updates, use a secure communication protocol, such as HTTPS or TLS, and ensure the update process is authenticated and encrypted.
  • When integrating the SE050C2HQ1 with other components, ensure proper signal integrity, power supply decoupling, and noise reduction. Use a multi-layer PCB with a solid ground plane, and consider using shielding and filtering to minimize electromagnetic interference (EMI). Also, ensure that the SE050C2HQ1 is properly powered and clocked, and that the system's power management is designed to handle the device's power requirements.
  • To optimize the SE050C2HQ1's performance and power consumption, analyze your specific use case and adjust the device's configuration accordingly. Consider factors such as clock speed, voltage, and power modes. Use NXP's power estimation tools and documentation to estimate power consumption and optimize the device's configuration for your specific application.
  • When using the SE050C2HQ1, ensure that you follow secure coding practices, use secure protocols for communication, and implement secure key management. Also, consider using secure boot mechanisms, secure firmware updates, and secure data storage. Regularly review and update your system's security to address potential vulnerabilities and ensure compliance with relevant security standards.

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SE050C2HQ1/Z01SDZ Overview

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About NXP

NXP Semiconductors is a leading manufacturer of semiconductor devices with a wide range of semiconductor solutions, including microcontrollers, sensors, connectivity solutions, power management ICs, and security solutions. These products are used in a variety of applications such as automotive, industrial automation, smart homes, mobile devices, and more. NXP Semiconductors is one of the world’s largest semiconductor companies and is headquartered in Eindhoven, the Netherlands.

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