SF-0402FP175F-2 footprint, schematic symbol and 3D model by Bourns

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SF-0402FP175F-2 Details

The recommended land pattern for SF-0402FP175F-2 is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
While SF-0402FP175F-2 is rated for operation up to 125°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
To prevent ESD damage, handle SF-0402FP175F-2 components with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the PCB and assembly process also follow ESD-safe practices.
The recommended soldering profile for SF-0402FP175F-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. This ensures proper solder wetting and minimizes the risk of thermal damage.
While SF-0402FP175F-2 is not specifically designed for humid or moist environments, it can still be used in such conditions with proper PCB design and assembly practices. Ensure that the component is properly sealed, and the PCB is designed with moisture-resistant materials and coatings.

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Use the download button to access the SF-0402FP175F-2 schematic symbol, PCB footprint, and 3D model.

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