SF-0402S050M-2 footprint, schematic symbol and 3D model by Bourns

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3D Models

SF-0402S050M-2 Details

The recommended land pattern for SF-0402S050M-2 is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape. This is to ensure proper soldering and to prevent solder bridging.
While SF-0402S050M-2 is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material should be suitable for high-temperature applications.
To prevent damage, handle the SF-0402S050M-2 by the edges, avoid touching the component's surface, and use anti-static wrist straps or mats. During PCB assembly, ensure that the component is properly aligned and seated on the PCB to prevent mechanical stress.
The recommended soldering profile for SF-0402S050M-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
While SF-0402S050M-2 is designed to operate in a variety of environments, it's essential to consider the component's moisture sensitivity level (MSL) rating of 3. This means that the component can withstand some humidity, but it's crucial to follow proper storage and handling procedures to prevent moisture absorption.

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Use the download button to access the SF-0402S050M-2 schematic symbol, PCB footprint, and 3D model.

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