The recommended land pattern for SF-0402S300-2 is a rectangular pad with a size of 0.5 mm x 0.5 mm, with a non-solder mask defined (NSMD) pad shape.
Yes, SF-0402S300-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated to avoid overheating.
Handle the SF-0402S300-2 by the body, avoiding touching the leads or the ceramic element. Use a vacuum pickup or tweezers to handle the component during assembly and rework.
The recommended soldering profile for SF-0402S300-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds. Ensure that the component is properly aligned and secured during the soldering process.
Yes, SF-0402S300-2 is designed to withstand high-vibration and high-shock environments. However, it's essential to ensure that the component is properly secured to the PCB and that the PCB is designed to withstand the expected vibration and shock levels.
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SF-0402S300-2 Overview
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