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SF-0603HI100F-2 - Bourns

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SF-0603HI100F-2 - Bourns  - 3D model
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SF-0603HI100F-2 Details

  • Manufacturer Part Number:

    SF-0603HI100F-2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.10.00.40

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7.95

  • Additional Feature:

    RATED BREAKING CAPACITY AT 35 VDC: 50 A

  • Body Breadth:

    0.81 mm

  • Body Height:

    0.36 mm

  • Body Length or Diameter:

    1.6 mm

  • Circuit Protection Type:

    ELECTRIC FUSE

  • Fuse Size:

    0603

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    90 °C

  • Operating Temperature-Min:

    -55 °C

  • Packing Method:

    TR, 7 INCH

  • Pre-arcing Time-Min:

    1 ms

  • Rated Breaking Capacity:

    13 A

  • Rated Current:

    1 A

  • Rated Voltage(AC):

    35 V

  • Rated Voltage(DC):

    65 V

  • Reference Standard:

    CUL; UL

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Shape:

    WRAPAROUND

  • Trip Time or Delay:

    0.0002 s

SF-0603HI100F-2 Frequently Asked Questions (FAQs)

  • The recommended land pattern for SF-0603HI100F-2 is a rectangular pad with a size of 0.65 mm x 0.65 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
  • While SF-0603HI100F-2 is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the user should evaluate the component's performance under high-temperature conditions and ensure it meets the application's requirements.
  • To prevent damage during PCB assembly, handle the SF-0603HI100F-2 by the edges, avoid touching the component's leads or body, and use anti-static wrist straps or mats to prevent electrostatic discharge (ESD). Additionally, ensure that the component is properly seated on the PCB and avoid applying excessive force during soldering.
  • The recommended soldering profile for SF-0603HI100F-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. It's essential to follow the soldering profile recommended by Bourns Inc to ensure reliable solder joints and prevent component damage.
  • While SF-0603HI100F-2 is designed to operate in a variety of environments, it's essential to consider the component's moisture sensitivity level (MSL) rating of 3. This means that the component can withstand some humidity, but it's crucial to follow proper handling and storage procedures to prevent moisture-related issues.

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SF-0603HI100F-2 Overview

Use the download button to access the SF-0603HI100F-2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like SF-06, or try a keyword search, such as Electric Fuses

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