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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SF-0603HI100M-2
- Part Number SF-0603HI100M-2
- Manufacturer Bourns
- Last Modified Date Jun 14, 2024 5:50 AM UTC
- Pinout / Pin List Click Here (Member Only)
SF-0603HI100M-2 Details
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Manufacturer Part Number:
SF-0603HI100M-2
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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HTS Code:
8536.10.00.40
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Factory Lead Time:
14 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
8
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Blow Characteristic:
FAST
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Body Breadth:
0.8 mm
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Body Height:
0.8 mm
SF-0603HI100M-2 Frequently Asked Questions (FAQs)
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The recommended land pattern for SF-0603HI100M-2 is a rectangular pad with a size of 0.65 mm x 0.35 mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
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While SF-0603HI100M-2 is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component does not exceed its maximum operating temperature. Additionally, the soldering process and PCB material selection should be suitable for high-temperature applications.
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To minimize the risk of moisture-related failures, it's recommended to store SF-0603HI100M-2 in a dry environment (less than 30% relative humidity) and use a moisture-sensitive device handling procedure. Baking the components before assembly can also help to reduce moisture absorption.
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A typical soldering profile for SF-0603HI100M-2 would be a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. However, it's essential to consult the datasheet and follow the recommended soldering profile to ensure reliable assembly.
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While SF-0603HI100M-2 is a robust component, it's still important to consider the vibration specifications and ensure that the component is properly secured to the PCB. Additional mechanical support or potting may be necessary to prevent component dislodgement or damage in high-vibration applications.
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SF-0603HI100M-2 Overview
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