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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SF-0603HI250M-2
- Part Number SF-0603HI250M-2
- Manufacturer Bourns
- Last Modified Date Oct 10, 2026 1:45 PM UTC
- Pinout / Pin List Click Here (Member Only)
SF-0603HI250M-2 Details
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Manufacturer Part Number:
SF-0603HI250M-2
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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ECCN Code:
EAR99
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HTS Code:
8536.10.00.40
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Factory Lead Time:
14 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
8
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Blow Characteristic:
FAST
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Body Breadth:
0.8 mm
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Body Height:
0.8 mm
SF-0603HI250M-2 Frequently Asked Questions (FAQs)
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The recommended land pattern for SF-0603HI250M-2 is a rectangular pad with a size of 0.8mm x 1.2mm, with a non-solder mask defined (NSMD) pad shape. This ensures proper soldering and minimizes the risk of solder bridging.
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While SF-0603HI250M-2 is rated for operation up to 150°C, it's essential to consider the derating curve and ensure that the component doesn't exceed its maximum operating temperature. Additionally, consult with Bourns Inc. or a qualified engineer to determine the suitability of this component for your specific high-temperature application.
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To prevent damage during PCB assembly, handle the SF-0603HI250M-2 by the edges, avoid touching the component's leads or body, and use an anti-static wrist strap or mat. Also, ensure that the PCB is properly cleaned and dried before assembly to prevent moisture-related damage.
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The recommended soldering profile for SF-0603HI250M-2 is a peak temperature of 240°C ± 5°C, with a dwell time of 30-60 seconds above 220°C. Ensure that the soldering process is within the specified temperature range to prevent damage to the component.
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While SF-0603HI250M-2 is designed to operate in a variety of environments, it's essential to consider the component's moisture sensitivity level (MSL) rating of 3. This means that the component can withstand some humidity, but it's crucial to follow proper handling and storage procedures to prevent moisture-related damage.
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SF-0603HI250M-2 Overview
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