SF-1206FP050-2 footprint, schematic symbol and 3D model by Bourns

Symbol

PCB Footprints

3D Models

SF-1206FP050-2 Details

The recommended land pattern for SF-1206FP050-2 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad and a solder mask opening of 0.5 mm x 0.5 mm.
Yes, SF-1206FP050-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the application meets the recommended operating conditions.
Handle the SF-1206FP050-2 by the edges or the body, avoiding touching the terminations or the component's surface. Use a vacuum pickup or tweezers to handle the component during assembly and rework. Avoid applying excessive force, pressure, or heat during assembly and rework.
The recommended soldering profile for SF-1206FP050-2 is a peak temperature of 260°C, with a dwell time of 10-30 seconds above 220°C. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
SF-1206FP050-2 is not hermetically sealed and may not be suitable for use in humid or corrosive environments. If the application requires operation in such environments, consider using a conformal coating or potting compound to protect the component.

Community Provided

System Verified

Community Approved

Use the download button to access the SF-1206FP050-2 schematic symbol, PCB footprint, and 3D model.

To find more CAD model downloads similar to this part, try a partial part number search, like SF-12, or try a keyword search, such as Electric Fuses

If you searched for SF-1206FP050-2, you might also be interested in these parts:

Showing 0 results


Please enter a minimum 3 letters or numbers
← Prev Next →