SF-1206FP300-2 footprint, schematic symbol and 3D model by Bourns

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SF-1206FP300-2 Details

The recommended land pattern for SF-1206FP300-2 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad and a solder mask opening of 1.2 mm x 0.5 mm.
The SF-1206FP300-2 is rated for operation up to 150°C, but it's recommended to derate the current rating by 1.5% per degree Celsius above 125°C to ensure reliable operation.
Handle the SF-1206FP300-2 by the edges or the body, avoiding touching the pins or the ferrite core to prevent damage or contamination. Use ESD protection and follow standard PCB assembly procedures.
The SF-1206FP300-2 is designed for high-frequency applications up to 1 GHz, but it's essential to consider the self-resonant frequency (SRF) and the impedance characteristics when designing the circuit.
Store the SF-1206FP300-2 in a dry, cool place, away from direct sunlight and moisture. Avoid exposing the components to mechanical stress, and use anti-static packaging and handling procedures.

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