SF-1206FP500-2 footprint, schematic symbol and 3D model by Bourns

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SF-1206FP500-2 Details

The recommended land pattern for the SF-1206FP500-2 is a rectangular pad with a size of 1.5 mm x 3.2 mm, with a non-solder mask defined (NSMD) pad shape.
The SF-1206FP500-2 has a thermal resistance of 35°C/W. To handle thermal considerations, ensure good thermal conduction by using a thermal pad or thermal interface material, and provide adequate airflow around the component.
The recommended soldering profile for the SF-1206FP500-2 is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. A reflow soldering process is recommended.
Yes, the SF-1206FP500-2 is suitable for high-reliability applications. It is built with a robust design and has undergone rigorous testing to ensure its reliability in harsh environments.
After soldering, clean the SF-1206FP500-2 with a mild solvent, such as isopropyl alcohol, to remove any flux residue. Ensure the component is dried thoroughly to prevent moisture-related issues.

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