- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SF-1206S200-2
- Part Number SF-1206S200-2
- Manufacturer Bourns
- Pin Count 2
- Part Category Fuse
- Package Category Fuses Chip
- Footprint Name Fuses Chip - SF-1206S
- Released Date Sep 12, 2020
- Last Modified Date Mar 7, 2023 4:10 PM UTC
- Pinout / Pin List Click Here (Member Only)
SF-1206S200-2 Details
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Manufacturer Part Number:
SF-1206S200-2
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Pbfree Code:
Yes
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Taiwan
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ECCN Code:
EAR99
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HTS Code:
8536.10.00.40
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Factory Lead Time:
12 Weeks
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Manufacturer:
Bourns Inc
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YTEOL:
7
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Blow Characteristic:
SLOW
SF-1206S200-2 Frequently Asked Questions (FAQs)
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The recommended land pattern for the SF-1206S200-2 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad shape.
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Yes, the SF-1206S200-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, the device's performance and reliability may degrade at extreme temperatures.
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Handle the SF-1206S200-2 by the body, avoiding touching the leads or the component's electrical contacts. Use a vacuum pickup or tweezers to handle the component during assembly and rework.
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The recommended soldering profile for the SF-1206S200-2 is a peak temperature of 240°C, with a dwell time of 30-60 seconds above 217°C. The soldering process should be completed within 3-5 minutes.
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Yes, the SF-1206S200-2 is designed to withstand high-vibration environments. However, the device's performance and reliability may be affected by extreme vibration levels.
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SF-1206S200-2 Overview
Use the download button to access the SF-1206S200-2 schematic symbol, PCB footprint, and 3D model.
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