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SF-1206SP200-2 - Bourns

Description: Fuse Chip Slow Blow Acting 2A 63V SMD Solder Pad 1206 T/R

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SF-1206SP200-2 - Bourns - PCB symbol
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PCB Footprints
SF-1206SP200-2 - Bourns PCB footprint - Fuses Chip - Fuses Chip - SF-1206SP200-2
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3D Models
SF-1206SP200-2 - Bourns - 3D model - Fuses Chip - SF-1206SP200-2
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SF-1206SP200-2 Details

  • Manufacturer Part Number:

    SF-1206SP200-2

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.10.00.40

  • Manufacturer:

    Bourns Inc

  • YTEOL:

    7

  • Blow Characteristic:

    TIME LAG

  • Body Breadth:

    1.55 mm

  • Body Height:

    0.6 mm

  • Body Length or Diameter:

    3.1 mm

  • Circuit Protection Type:

    ELECTRIC FUSE

  • Fuse Size:

    1206

  • JESD-609 Code:

    e3

  • Mounting Feature:

    SURFACE MOUNT

  • Operating Temperature-Max:

    105 °C

  • Operating Temperature-Min:

    -20 °C

  • Packing Method:

    TR, 7 INCH

  • Rated Breaking Capacity:

    50 A

  • Rated Current:

    2 A

  • Rated Voltage(DC):

    63 V

  • Reference Standard:

    UL

  • Surface Mount:

    YES

  • Terminal Finish:

    TIN OVER NICKEL

  • Terminal Shape:

    WRAPAROUND

  • Trip Time or Delay:

    1 s

SF-1206SP200-2 Frequently Asked Questions (FAQs)

  • The recommended land pattern for the SF-1206SP200-2 is a rectangular pad with a size of 1.5 mm x 0.8 mm, with a non-solder mask defined (NSMD) pad and a solder mask opening of 0.5 mm x 0.5 mm.
  • Yes, the SF-1206SP200-2 is rated for operation up to 150°C, making it suitable for high-temperature applications. However, it's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings.
  • The SF-1206SP200-2 is designed to handle surge currents up to 200 A for 10 ms, making it suitable for applications that require high surge current capability. However, it's crucial to ensure that the component is properly sized and that the operating conditions do not exceed the maximum ratings.
  • Yes, the SF-1206SP200-2 is compatible with lead-free soldering processes and is RoHS compliant. It's essential to follow the recommended soldering profile and ensure that the component is properly soldered to prevent damage or failure.
  • The typical failure mode of the SF-1206SP200-2 is thermal runaway, which can occur due to excessive current, voltage, or temperature. It's essential to ensure that the component is properly derated and that the operating conditions do not exceed the maximum ratings to prevent failure.

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SF-1206SP200-2 Overview

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