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SF56G-TP - MCC

Description: Super Fast Recovery Rectifiers

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Symbol
SF56G-TP - MCC - PCB symbol
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PCB Footprints
SF56G-TP - MCC PCB footprint - Diodes, Axial Diameter Horizontal Mounting - Diodes, Axial Diameter Horizontal Mounting - SF56G-TP_2
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3D Models
SF56G-TP - MCC - 3D model - Diodes, Axial Diameter Horizontal Mounting - SF56G-TP_2
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SF56G-TP Details

  • Manufacturer Part Number:

    SF56G-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DO-201AD

  • Package Description:

    ROHS COMPLIANT, PLASTIC PACKAGE-2

  • Pin Count:

    2

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.80

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.99

  • Additional Feature:

    LOW POWER LOSS

  • Application:

    EFFICIENCY

  • Case Connection:

    ISOLATED

  • Configuration:

    SINGLE

  • Diode Element Material:

    SILICON

  • Diode Type:

    RECTIFIER DIODE

  • Forward Voltage-Max (VF):

    1.27 V

  • JEDEC-95 Code:

    DO-201AD

  • JESD-30 Code:

    O-PALF-W2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Non-rep Pk Forward Current-Max:

    150 A

  • Number of Elements:

    1

  • Number of Phases:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Output Current-Max:

    5 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    ROUND

  • Package Style:

    LONG FORM

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    400 V

  • Reverse Current-Max:

    5 µA

  • Reverse Recovery Time-Max:

    0.035 µs

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    WIRE

  • Terminal Position:

    AXIAL

  • Time@Peak Reflow Temperature-Max (s):

    10

SF56G-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the SF56G-TP away from high-current carrying traces, using a solid ground plane, and ensuring good thermal conductivity. Thermal management involves using a heat sink or thermal pad to keep the junction temperature below 125°C.
  • To ensure reliable operation in high-temperature environments, it's essential to follow the recommended operating temperature range (–40°C to 125°C), use a heat sink or thermal pad, and ensure good airflow around the device. Additionally, consider using a thermistor or thermal sensor to monitor the temperature.
  • The SF56G-TP has built-in ESD protection, but it's still essential to follow proper handling precautions, such as using an ESD wrist strap, mat, or workstation, and avoiding direct contact with the device's pins. Store the device in an anti-static bag or container when not in use.
  • Yes, the SF56G-TP is designed to withstand moderate vibration and shock. However, it's essential to follow proper mounting and soldering techniques to ensure the device is securely attached to the PCB. Consider using a vibration-resistant mounting method, such as a screw-down or adhesive-based attachment.
  • To troubleshoot common issues, start by checking the PCB layout, thermal management, and power supply connections. Verify that the device is operated within the recommended specifications and environmental conditions. Use a thermal camera or thermometer to check for overheating, and consult the datasheet or application notes for guidance on troubleshooting specific issues.

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SF56G-TP Overview

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For a full list of alternate parts for SF56G-TP, check out Findchips.com