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SFH6345-X001 - Vishay

Description: High Speed Optocouplers 1Mbd High-Speed Trans Out CTR>30%

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SFH6345-X001 - Vishay PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - DIP-8 (Standard)
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3D Models
SFH6345-X001 - Vishay  - 3D model - Dual-In-Line Packages - DIP-8 (Standard)
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SFH6345-X001 Details

  • Manufacturer Part Number:

    SFH6345-X001

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.40.80.00

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7.15

  • Additional Feature:

    OPEN COLLECTOR, UL APPROVED, TTL COMPATIBLE, VDE APPROVED

  • Configuration:

    SINGLE

  • Data Rate-Nom:

    1 MBps

  • Forward Current-Max:

    0.025 A

  • Isolation Voltage-Max:

    5300 V

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Functions:

    1

  • On-State Current-Max:

    0.008 A

  • Operating Temperature-Max:

    70 °C

  • Optoelectronic Device Type:

    LOGIC IC OUTPUT OPTOCOUPLER

  • Terminal Finish:

    Matte Tin (Sn)

SFH6345-X001 Frequently Asked Questions (FAQs)

  • Vishay provides a recommended PCB layout and land pattern in their application note AN10277, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal management and minimize thermal resistance.
  • To prevent damage during assembly and testing, it's recommended to use a current-limited power supply and follow proper handling procedures, such as using a wrist strap or anti-static mat to prevent electrostatic discharge (ESD). Additionally, ensure that the device is properly soldered and that the PCB is designed to handle high currents.
  • While the datasheet specifies an operating temperature range of -40°C to 125°C, it's essential to note that the device's performance and reliability may degrade at extreme temperatures. It's recommended to operate the device within a temperature range of -20°C to 100°C for optimal performance and reliability.
  • Proper cooling is crucial for the SFH6345-X001. Ensure that the device is mounted on a heat sink or a metal core PCB with a thermal via structure to dissipate heat efficiently. Additionally, consider using a thermal interface material (TIM) to improve heat transfer between the device and the heat sink.
  • To prevent damage and ensure long-term reliability, store the SFH6345-X001 in a dry, cool place (less than 30°C and 60% relative humidity) away from direct sunlight and moisture. Avoid exposing the device to mechanical stress, vibration, or extreme temperatures during storage and handling.

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SFH6345-X001 Overview

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