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SG2524BN - Microsemi Corporation

Description: Flyback Regulator Positive Output Step-Up/Step-Down DC-DC Controller IC 16-PDIP

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SG2524BN - Microsemi Corporation PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 16-pin PDIP
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SG2524BN - Microsemi Corporation  - 3D model - Dual-In-Line Packages - 16-pin PDIP
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SG2524BN Details

  • Manufacturer Part Number:

    SG2524BN

  • Pbfree Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Part Package Code:

    DIP

  • Package Description:

    DIP-16

  • Pin Count:

    16

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Microsemi Corporation (now Microchip)

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    VOLTAGE-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    40 V

  • Input Voltage-Min:

    7 V

  • Input Voltage-Nom:

    20 V

  • JESD-30 Code:

    R-PDIP-T16

  • JESD-609 Code:

    e3

  • Length:

    19.555 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -25 °C

  • Output Current-Max:

    0.2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP16,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    5.08 mm

  • Surface Mount:

    NO

  • Switcher Configuration:

    PUSH-PULL

  • Switching Frequency-Max:

    600 kHz

  • Technology:

    BIPOLAR

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Width:

    7.62 mm

SG2524BN Frequently Asked Questions (FAQs)

  • A good PCB layout for the SG2524BN involves keeping the input and output traces short and away from each other, using a solid ground plane, and placing decoupling capacitors close to the device. Additionally, it's recommended to use a shielded enclosure and to keep the device away from other noise-sensitive components.
  • To ensure proper biasing, make sure to follow the recommended voltage and current settings outlined in the datasheet. Additionally, use a stable voltage source, and decouple the input and output pins with capacitors to reduce noise and oscillations.
  • The SG2524BN has a maximum junction temperature of 150°C. To prevent overheating, ensure good airflow around the device, use a heat sink if necessary, and avoid operating the device at maximum power for extended periods. Also, follow the recommended thermal design guidelines outlined in the datasheet.
  • To troubleshoot issues with the SG2524BN, start by checking the power supply and input/output connections for any signs of noise or oscillations. Verify that the device is properly biased and that the input and output capacitors are properly sized. Use an oscilloscope to visualize the waveforms and identify any anomalies. If the issue persists, consult the datasheet and application notes for guidance.
  • Yes, when using the SG2524BN in a high-reliability or high-availability application, consider using redundant systems, implementing error detection and correction mechanisms, and following strict quality control and testing procedures. Additionally, ensure that the device is operated within its recommended specifications and that the system is designed to tolerate single-point failures.

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SG2524BN Overview

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