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SG5841JSZ - onsemi

Description: Green-Mode PWM Controller ƒ Low Startup Current : 14µA ƒ Low Operating Current: 4mA ƒ Programmable PWM Frequency with Hopping ƒ Peak-Current-Mode Control ƒ Cycle-by-Cycle Current Limiting ƒ Synchronized Slope Compensation ƒ Leading-Edge Blanking (LEB) ƒ Constant Output Power Limit ƒ Totem Pole Output with Soft Driving ƒ VDD Over-Voltage Clamping ƒ Programmable Over-Temperat

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SG5841JSZ - onsemi PCB footprint - Small Outline Packages - Small Outline Packages - 8-Pin Small Outline Package (SOP)
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SG5841JSZ - onsemi  - 3D model - Small Outline Packages - 8-Pin Small Outline Package (SOP)
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SG5841JSZ Details

  • Manufacturer Part Number:

    SG5841JSZ

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC-8

  • Package Description:

    SOP-8

  • Manufacturer Package Code:

    751EB

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Analog IC - Other Type:

    SWITCHING CONTROLLER

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    24.7 V

  • Input Voltage-Min:

    11 V

  • Input Voltage-Nom:

    15 V

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e4

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -20 °C

  • Output Current-Max:

    0.23 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max (Isup):

    5 mA

  • Surface Mount:

    YES

  • Switcher Configuration:

    SINGLE

  • Switching Frequency-Max:

    68 kHz

  • Technology:

    BICMOS

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    3.9 mm

SG5841JSZ Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Ensure proper heat sinking, use a thermal interface material, and follow the recommended PCB layout. Also, consider derating the device's power dissipation at high temperatures.
  • The SOA is not explicitly stated in the datasheet. However, it's recommended to operate the device within the specified voltage and current limits to ensure reliability and prevent damage.
  • Use proper handling and storage procedures, and implement EOS and ESD protection circuits in your design, such as TVS diodes and resistors.
  • Follow the recommended soldering profile: peak temperature 260°C, time above 217°C 60-90 seconds, and a maximum of 3 reflows.

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SG5841JSZ Overview

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