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SH8KA1GZETB - ROHM Semiconductor

Description: 30V Nch+Nch Power MOSFET

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SH8KA1GZETB - ROHM Semiconductor - PCB symbol
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PCB Footprints
SH8KA1GZETB - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - 8 lead sop
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3D Models
SH8KA1GZETB - ROHM Semiconductor - 3D model - Small Outline Packages - 8 lead sop
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SH8KA1GZETB Details

  • Manufacturer Part Number:

    SH8KA1GZETB

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Date Of Intro:

    2018-11-20

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    5.32

  • Avalanche Energy Rating (Eas):

    1.1 mJ

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain-source On Resistance-Max:

    0.08 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SH8KA1GZETB Frequently Asked Questions (FAQs)

  • ROHM recommends a thermal pad design with a minimum size of 2.5mm x 2.5mm and a thermal via array with a minimum of 10 vias to ensure optimal heat dissipation.
  • To ensure reliable operation in high-temperature environments, it's essential to follow ROHM's recommended operating conditions, including derating the device's power dissipation and using a suitable thermal management system.
  • ROHM recommends soldering the SH8KA1GZETB using a reflow soldering process with a peak temperature of 260°C and a dwell time of 30 seconds to 60 seconds.
  • The SH8KA1GZETB requires a specific power sequencing order to prevent damage. ROHM recommends powering up the VCC pin before the VIN pin, and powering down the VIN pin before the VCC pin.
  • Operating the SH8KA1GZETB beyond its recommended operating conditions can lead to reduced reliability, decreased performance, and potentially even device failure. It's essential to follow ROHM's recommended operating conditions to ensure reliable operation.

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SH8KA1GZETB Overview

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