ROHM recommends a thermal pad on the bottom of the package, connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2oz copper thickness is recommended, and the thermal pad should be connected to a ground plane to reduce thermal resistance.
To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal design and layout guidelines. Additionally, consider using thermal interface materials (TIMs) to improve heat transfer between the device and the heat sink or PCB. ROHM also recommends derating the device's power consumption and voltage ratings according to the operating temperature.
ROHM recommends soldering the SH8M24GZETB using a reflow soldering process with a peak temperature of 260°C (500°F) and a dwell time of 30 seconds. The recommended soldering temperature profile can be found in the ROHM Semiconductor's 'Soldering Conditions' document.
ROHM recommends following proper ESD handling and storage procedures to prevent damage to the device. This includes using ESD-protective packaging, wrist straps, and mats, as well as grounding all equipment and personnel before handling the device.
The SH8M24GZETB is not hermetically sealed, so it's essential to follow proper moisture sensitivity level (MSL) handling and storage procedures to prevent moisture-related damage. ROHM recommends storing the device in a dry, nitrogen-filled environment and following the recommended baking procedures before use.
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SH8M24GZETB Overview
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