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SH8M24TB1 - ROHM Semiconductor

Description: 45V Nch+Pch Power MOSFET

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SH8M24TB1 - ROHM Semiconductor - PCB symbol
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PCB Footprints
SH8M24TB1 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - 8 lead sop
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3D Models
SH8M24TB1 - ROHM Semiconductor - 3D model - Small Outline Packages - 8 lead sop
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SH8M24TB1 Details

  • Manufacturer Part Number:

    SH8M24TB1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    45 V

  • Drain Current-Max (ID):

    6 A

  • Drain-source On Resistance-Max:

    0.064 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    70 pF

  • JESD-30 Code:

    R-PDSO-G8

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR, EMBOSSED, 13 INCH

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    3.1 W

  • Pulsed Drain Current-Max (IDM):

    18 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SH8M24TB1 Frequently Asked Questions (FAQs)

  • A thermal pad is recommended under the IC, and a 2-layer or 4-layer PCB with a solid ground plane is suggested to reduce thermal resistance. A minimum of 2 oz copper thickness is recommended for the thermal pad.
  • Ensure that the device is operated within the recommended voltage range (2.7V to 5.5V) and that the PCB is designed to minimize thermal gradients. Also, consider using a thermal interface material (TIM) to improve heat transfer between the IC and the heat sink.
  • Handle the device by the body, avoiding touching the pins. Store the device in a dry, cool place, away from direct sunlight and moisture. Avoid bending or flexing the leads, and use an anti-static wrist strap or mat when handling the device.
  • Check the power supply voltage, ensure correct pin connections, and verify that the device is not damaged. Use a multimeter to measure voltage and current at the input and output pins. Consult the datasheet and application notes for troubleshooting guidelines.
  • Use a shielded enclosure, ensure proper grounding, and use EMI filters or chokes as needed. Follow the PCB layout guidelines in the datasheet and application notes to minimize EMI radiation. Consult with an EMI/EMC expert if necessary.

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SH8M24TB1 Overview

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