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SH8M41TB1 - ROHM Semiconductor

Description: 80V Nch+Pch Power MOSFET

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SH8M41TB1 - ROHM Semiconductor - PCB symbol
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PCB Footprints
SH8M41TB1 - ROHM Semiconductor PCB footprint - Small Outline Packages - Small Outline Packages - 8 lead sop
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3D Models
SH8M41TB1 - ROHM Semiconductor - 3D model - Small Outline Packages - 8 lead sop
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SH8M41TB1 Details

  • Manufacturer Part Number:

    SH8M41TB1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    16 Weeks

  • Manufacturer:

    ROHM Semiconductor

  • YTEOL:

    7

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    80 V

  • Drain Current-Max (ID):

    3.4 A

  • Drain-source On Resistance-Max:

    0.16 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    40 pF

  • JESD-30 Code:

    R-PDSO-G8

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL AND P-CHANNEL

  • Power Dissipation-Max (Abs):

    2 W

  • Pulsed Drain Current-Max (IDM):

    13.6 A

  • Surface Mount:

    YES

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SH8M41TB1 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a dedicated thermal plane and vias under the IC is recommended for optimal thermal performance. Ensure a solid ground plane and minimize thermal resistance between the IC and the heat sink.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure proper airflow and consider using a thermal shield or enclosure to reduce ambient temperature.
  • Use a multi-layer PCB with a solid ground plane, and ensure proper decoupling and filtering of power supply lines. Implement EMI shielding and consider using a metal enclosure to reduce electromagnetic radiation.
  • Use a low-ESR capacitor and a high-quality voltage regulator. Ensure the power supply can provide the required current and voltage, and consider using a power supply filter to reduce noise and ripple.
  • Use a soldering iron with a temperature range of 250°C to 300°C. Apply a small amount of solder paste and use a reflow oven or hot air rework station to minimize thermal stress.

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SH8M41TB1 Overview

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