- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SH8MA2GZETB
- Part Number SH8MA2GZETB
- Manufacturer ROHM Semiconductor
- Pin Count 8
- Part Category Integrated Circuit
- Package Category Small Outline Packages
- Footprint Name Small Outline Packages - SOP8-ROHM
- Released Date Sep 16, 2022
- Last Modified Date Apr 22, 2025 2:34 PM UTC
- Pinout / Pin List Click Here (Member Only)
SH8MA2GZETB Details
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Manufacturer Part Number:
SH8MA2GZETB
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
SOP-8
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ECCN Code:
EAR99
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Date Of Intro:
2018-11-20
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Manufacturer:
ROHM Semiconductor
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YTEOL:
5.32
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Avalanche Energy Rating (Eas):
1.1 mJ
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Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
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DS Breakdown Voltage-Min:
30 V
SH8MA2GZETB Frequently Asked Questions (FAQs)
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ROHM recommends a thermal pad design with a minimum size of 2.5mm x 2.5mm, and a thermal via array with a minimum of 10 vias, 0.3mm in diameter, spaced 1.2mm apart, to ensure efficient heat dissipation.
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To ensure reliable operation in high-temperature environments, it's essential to follow ROHM's recommended derating guidelines, which can be found in the datasheet. Additionally, consider using a heat sink or thermal interface material to reduce the junction temperature.
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Although the datasheet doesn't explicitly state the maximum allowed voltage for the input pins, ROHM recommends limiting the input voltage to VCC + 0.3V to prevent damage to the device.
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Yes, the SH8MA2GZETB is suitable for high-frequency applications up to 100MHz. However, it's essential to follow proper PCB design and layout guidelines to minimize signal integrity issues and ensure reliable operation.
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ROHM recommends following standard ESD protection guidelines, such as using ESD-sensitive handling procedures, and incorporating ESD protection devices, such as TVS diodes or ESD arrays, in the circuit design.
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SH8MA2GZETB Overview
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