Sensirion recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 3-5 minutes.
Store the SHT31-DIS-B2.5KS in a dry, nitrogen-filled package or a moisture barrier bag with a desiccant packet to maintain a relative humidity below 20%. Avoid exposing the device to ambient air for extended periods.
Follow the recommended land pattern and PCB layout guidelines provided in the Sensirion application note 'SHT3x-DIS-B Layout Recommendations' to ensure proper thermal and electrical connections.
Calibration is not required for the SHT31-DIS-B2.5KS, as it is calibrated during manufacturing. However, you can perform a system-level calibration to compensate for any system-specific errors or offsets.
Power up the SHT31-DIS-B2.5KS by applying VCC first, followed by the signal lines. Power down the device by reversing this sequence, ensuring that the signal lines are released before VCC.
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