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SHT31-DIS-B2.5KS - Sensirion

Description: SHT31-DIS-B2.5KS

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PCB Footprints
SHT31-DIS-B2.5KS - Sensirion PCB footprint - Small Outline No-lead - Small Outline No-lead - SHT3x-DIS-1
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3D Models
SHT31-DIS-B2.5KS - Sensirion  - 3D model - Small Outline No-lead - SHT3x-DIS-1
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SHT31-DIS-B2.5KS Details

  • Manufacturer Part Number:

    SHT31-DIS-B2.5KS

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Switzerland

  • ECCN Code:

    EAR99

  • Manufacturer:

    Sensirion

  • Body Breadth:

    2.5 mm

  • Body Height:

    0.9 mm

  • Body Length or Diameter:

    2.5 mm

  • JESD-609 Code:

    e4

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output:

    OPEN-DRAIN

  • Output Type:

    DIGITAL OUTPUT

  • Package Body Material:

    PLASTIC

  • Package Equivalence Code:

    SOLCC8,.09,20

  • Package Shape/Style:

    SQUARE

  • Sensors/Transducers Type:

    HUMIDITY AND TEMPERATURE SENSOR

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    2.15 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

SHT31-DIS-B2.5KS Frequently Asked Questions (FAQs)

  • Sensirion recommends a reflow soldering profile with a peak temperature of 260°C, a dwell time above 220°C of 30-60 seconds, and a total process time of 3-5 minutes.
  • Store the SHT31-DIS-B2.5KS in a dry, nitrogen-filled package or a moisture barrier bag with a desiccant packet to maintain a relative humidity below 20%. Avoid exposing the device to ambient air for extended periods.
  • Follow the recommended land pattern and PCB layout guidelines provided in the Sensirion application note 'SHT3x-DIS-B Layout Recommendations' to ensure proper thermal and electrical connections.
  • Calibration is not required for the SHT31-DIS-B2.5KS, as it is calibrated during manufacturing. However, you can perform a system-level calibration to compensate for any system-specific errors or offsets.
  • Power up the SHT31-DIS-B2.5KS by applying VCC first, followed by the signal lines. Power down the device by reversing this sequence, ensuring that the signal lines are released before VCC.

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SHT31-DIS-B2.5KS Overview

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