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SI-60116-F - Bel Magnetic Solutions

Description: Modular Connectors / Ethernet Connectors MagJack 10/100BaseT, 1X1, G/Y, Tab Down, RoHS

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SI-60116-F - Bel Magnetic Solutions PCB footprint - Other - Other - SI-60116-F-2
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SI-60116-F Details

  • Manufacturer Part Number:

    SI-60116-F

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8536.69.40.30

  • Manufacturer:

    Bel Fuse

  • YTEOL:

    8

  • Additional Feature:

    SHIELDED

  • Board Mounting Option:

    HOLE 0.125-0.128

  • Body Breadth:

    0.599 inch

  • Body Depth:

    0.85 inch

  • Body Length:

    0.635 inch

  • Connector Type:

    RJ CONNECTOR

  • Contact Finish Mating:

    NOT SPECIFIED

  • Contact Gender:

    FEMALE

  • Contact Material:

    NOT SPECIFIED

  • Contact Pattern:

    RECTANGULAR

  • Contact Style:

    MODULAR RJ45

  • Dielectric Withstanding Voltage:

    1500VAC V

  • Empty Shell:

    NO

  • Filter Feature:

    YES

  • Insulator Material:

    POLYETHYLENE

  • Mixed Contacts:

    NO

  • Mounting Option 1:

    MOUNTING FLANGE

  • Mounting Option 2:

    LOCKING

  • Mounting Style:

    RIGHT ANGLE

  • Mounting Type:

    BOARD AND PANEL

  • Number Of PCB Rows:

    2

  • Number of Ports:

    1

  • Number of Rows Loaded:

    1

  • Operating Temperature-Max:

    70 °C

  • Option:

    GENERAL PURPOSE

  • PCB Contact Pattern:

    STAGGERED

  • PCB Contact Row Spacing:

    2.54 mm

  • Plating Thickness:

    50u inch

  • Polarization Key:

    POLARIZED HOUSING

  • Reference Standard:

    UL

  • Shell Finish:

    NICKEL/TIN

  • Shell Material:

    COPPER ALLOY

  • Terminal Length:

    0.11 inch

  • Terminal Pitch:

    2.54 mm

  • Termination Type:

    SOLDER

  • Total Number of Contacts:

    8

  • UL Flammability Code:

    94V-0

SI-60116-F Frequently Asked Questions (FAQs)

  • Bel Fuse provides a recommended PCB layout and land pattern in their application notes, which can be found on their website. It's essential to follow these guidelines to ensure proper thermal management, reduce electromagnetic interference (EMI), and optimize the overall performance of the module.
  • To ensure reliability and longevity, it's crucial to follow proper derating guidelines, provide adequate cooling, and avoid exceeding the maximum operating temperature. Additionally, consider using thermal interface materials, such as thermal pads or thermal grease, to improve heat transfer between the module and the heat sink.
  • The SI-60116-F has built-in EMI filtering capabilities, but their effectiveness can be optimized by following proper PCB layout and design practices, such as keeping the input and output traces separate, using a solid ground plane, and minimizing the loop area of the input and output circuits.
  • Yes, the SI-60116-F can be used in redundant or parallel configurations to increase power availability and reliability. However, it's essential to follow proper design and implementation guidelines to ensure that the modules are properly synchronized and that the system can handle the increased power output.
  • The SI-60116-F has various agency approvals and certifications, such as UL, CE, and RoHS. These certifications impact system design by ensuring that the module meets specific safety and environmental standards, which can affect the overall system design, testing, and certification process.

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SI-60116-F Overview

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