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SI2302-TP - MCC

Description: Small Signal MOSFETS

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PCB Footprints
SI2302-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SI2302-TP
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3D Models
SI2302-TP - MCC  - 3D model - SOT23 (3-Pin) - SI2302-TP
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SI2302-TP Details

  • Manufacturer Part Number:

    SI2302-TP

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Pin Count:

    3

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5.4

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.027 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    68 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.56 W

  • Pulsed Drain Current-Max (IDM):

    10 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI2302-TP Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the input and output traces short and away from each other to minimize noise and coupling.
  • Ensure good thermal conductivity by using a heat sink or thermal pad, and avoid blocking airflow around the device. Also, consider the thermal resistance of the PCB and surrounding components.
  • A 10uF to 22uF X7R or X5R ceramic capacitor is recommended for the input filter. The capacitor should be placed as close to the VIN pin as possible.
  • Use a output capacitor with a low ESR (Equivalent Series Resistance) and a high ripple current rating. Add a pi-filter or a LC-filter to further reduce the output ripple and noise.
  • The maximum allowed voltage drop across the input capacitor is 1V to ensure the device operates within the specified input voltage range.

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SI2302-TP Overview

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