Part Image

SI2302A-TP - MCC

Description: Small Signal MOSFETS

Download SI2302A-TP Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
SI2302A-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
click to zoom
3D Models
SI2302A-TP - MCC  - 3D model - SOT23 (3-Pin) - SOT-23-ren20
click to zoom

SI2302A-TP Details

  • Manufacturer Part Number:

    SI2302A-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    5

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3 A

  • Drain-source On Resistance-Max:

    0.032 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    59 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.25 W

  • Pulsed Drain Current-Max (IDM):

    12 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

SI2302A-TP Frequently Asked Questions (FAQs)

  • A good PCB layout for the SI2302A-TP involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a solid ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable 3.3V or 5V power supply, and the GND pin to a solid ground plane. The EN pin should be tied to VCC or a digital signal for enable/disable functionality. The VIN pin should be connected to a stable input voltage.
  • The maximum current rating of the SI2302A-TP is 2A. However, it's recommended to derate the current to 1.5A for optimal performance and to prevent overheating.
  • To protect the SI2302A-TP from overvoltage and undervoltage conditions, use a voltage regulator or a voltage supervisor to regulate the input voltage. Additionally, consider adding overvoltage protection (OVP) and undervoltage protection (UVP) circuits to prevent damage to the device.
  • The thermal resistance of the SI2302A-TP package is typically around 30°C/W. This means that for every watt of power dissipated, the junction temperature will increase by 30°C above the ambient temperature.

Trust Checks

This model has been built in collaboration with the manufacturer.
Manufacturer Collaborated
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

SI2302A-TP Overview

Use the download button to access the SI2302A-TP schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like SI230, or try a keyword search, such as Power Field-Effect Transistors

Parts related to SI2302A-TP

Showing 0 results