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SI2333DS-T1-GE3 - Vishay

Description: • Halogen-free According to IEC 61249-2-21 Available • TrenchFET® Power MOSFET

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Symbol
SI2333DS-T1-GE3 - Vishay - PCB symbol
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PCB Footprints
SI2333DS-T1-GE3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236): 3-LEAD
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3D Models
SI2333DS-T1-GE3 - Vishay - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236): 3-LEAD
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SI2333DS-T1-GE3 Details

  • Manufacturer Part Number:

    SI2333DS-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    12 V

  • Drain Current-Max (ID):

    4.1 A

  • Drain-source On Resistance-Max:

    0.032 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    300 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    20 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI2333DS-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI2333DS-T1-GE3 is a 2x2 array of 0.5mm diameter pads with a 1.3mm pitch. It's essential to follow the recommended footprint to ensure proper thermal and electrical performance.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C (500°F) and a solder with a melting point of 220°C (428°F). Apply a small amount of solder to the pads and reflow according to the recommended soldering profile.
  • The SI2333DS-T1-GE3 has an operating temperature range of -55°C to 150°C. However, it's essential to note that the device's performance may degrade at extreme temperatures, and the maximum junction temperature should not exceed 150°C.
  • While the SI2333DS-T1-GE3 is a high-quality device, it's essential to consult with Vishay Intertechnologies or a qualified representative to determine its suitability for high-reliability or aerospace applications. Additional testing and certification may be required.
  • To prevent electrostatic discharge (ESD) damage, handle the SI2333DS-T1-GE3 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure that the workspace and tools are grounded, and avoid touching the device's pins or leads.

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SI2333DS-T1-GE3 Overview

Use the download button to access the SI2333DS-T1-GE3 schematic symbol, PCB footprint, and 3D model.
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