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SI2343DS-T1-E3 - Vishay

Description: SI2343DS-T1-E3, P-channel MOSFET Transistor 3.1 A 30 V, 3-Pin SOT-23, TO-236

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PCB Footprints
SI2343DS-T1-E3 - Vishay PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23 (TO-236)
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3D Models
SI2343DS-T1-E3 - Vishay  - 3D model - SOT23 (3-Pin) - SOT-23 (TO-236)
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SI2343DS-T1-E3 Details

  • Manufacturer Part Number:

    SI2343DS-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-236, SOT-23, 3 PIN

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    3.1 A

  • Drain-source On Resistance-Max:

    0.053 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    105 pF

  • JEDEC-95 Code:

    TO-236AB

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.75 W

  • Pulsed Drain Current-Max (IDM):

    15 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    80 ns

  • Turn-on Time-Max (ton):

    40 ns

SI2343DS-T1-E3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI2343DS-T1-E3 is a 5-pin SOT23 package with a minimum pad size of 0.8 mm x 0.8 mm and a thermal pad size of 2.5 mm x 2.5 mm.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the pads. Avoid applying excessive heat or pressure, which can damage the device.
  • The maximum operating temperature range for the SI2343DS-T1-E3 is -40°C to 150°C, with a storage temperature range of -40°C to 150°C.
  • Yes, the SI2343DS-T1-E3 is suitable for high-reliability applications, such as automotive, industrial, and aerospace, due to its high-quality manufacturing process and rigorous testing procedures.
  • To prevent electrostatic discharge (ESD) damage, handle the SI2343DS-T1-E3 with an ESD wrist strap or mat, and ensure that all equipment and tools are properly grounded.

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SI2343DS-T1-E3 Overview

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Part Image SI2343DS-E3 Vishay Intertechnologies

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