- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for SI2377EDS-T1-BE3
- Part Number SI2377EDS-T1-BE3
- Manufacturer Vishay
- Pin Count 3
- Part Category Integrated Circuit
- Package Category SOT23 (3-Pin)
- Footprint Name SOT23 (3-Pin) - -SOT-23
- Released Date Jun 15, 2021
- Last Modified Date Oct 10, 2023 6:27 AM UTC
- Pinout / Pin List Click Here (Member Only)
SI2377EDS-T1-BE3 Details
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Manufacturer Part Number:
SI2377EDS-T1-BE3
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
TO-236, SOT-23, 3 PIN
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ECCN Code:
EAR99
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Factory Lead Time:
19 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
6.95
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Configuration:
SINGLE WITH BUILT-IN DIODE AND RESISTOR
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DS Breakdown Voltage-Min:
20 V
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Drain Current-Max (ID):
4.4 A
SI2377EDS-T1-BE3 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the SI2377EDS-T1-BE3 is a 4-pin SOT23 package with a 1.3mm x 1.3mm body size. The recommended land pattern is available in the Vishay Intertechnologies' application note or can be obtained from the manufacturer's website.
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To ensure reliability in high-temperature applications, it is recommended to follow the derating guidelines provided in the datasheet. Additionally, ensure proper thermal management, such as using a heat sink or thermal interface material, and follow the recommended PCB layout and assembly guidelines.
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The maximum allowed power dissipation for the SI2377EDS-T1-BE3 is dependent on the ambient temperature and the thermal resistance of the package. Refer to the datasheet for the power dissipation curves and thermal resistance values to determine the maximum allowed power dissipation for your specific application.
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Yes, the SI2377EDS-T1-BE3 is suitable for high-frequency switching applications. However, it is essential to consider the device's switching characteristics, such as the rise and fall times, and ensure that the device is operated within its recommended frequency range.
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To protect the SI2377EDS-T1-BE3 from electrostatic discharge (ESD), follow proper ESD handling and storage procedures, such as using ESD-safe materials, grounding straps, and ionizers. Additionally, ensure that the device is handled and assembled in an ESD-controlled environment.
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SI2377EDS-T1-BE3 Overview
Use the download button to access the SI2377EDS-T1-BE3 schematic symbol, PCB footprint, and 3D model.
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