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SI3139KDWA-TP - MCC

Description: Small Signal MOSFETS

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SI3139KDWA-TP - MCC PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - SI3139KDWA-TP
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SI3139KDWA-TP - MCC  - 3D model - SOT23 (6-Pin) - SI3139KDWA-TP
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SI3139KDWA-TP Details

  • Manufacturer Part Number:

    SI3139KDWA-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    SOT-363, 6 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    7

  • Configuration:

    SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    0.6 A

  • Drain-source On Resistance-Max:

    0.85 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    6.6 pF

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Number of Elements:

    2

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    0.32 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

SI3139KDWA-TP Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves keeping the input and output traces separate, using a solid ground plane, and placing the device near a heat sink or thermal pad. Thermal management is crucial, and a thermal pad or heat sink with a thermal conductivity of at least 1 W/m-K is recommended.
  • To ensure reliability, follow the recommended operating conditions, avoid exceeding the maximum ratings, and implement proper ESD protection. Additionally, ensure the device is stored and handled according to the manufacturer's guidelines, and consider using a conformal coating to protect against environmental factors.
  • Oscillation or instability can be caused by inadequate decoupling, incorrect component selection, or poor PCB layout. Ensure that the input and output capacitors are properly selected and placed, and that the PCB layout follows the recommended guidelines. Additionally, check for any noise or ripple on the input voltage.
  • To troubleshoot issues, start by verifying the input voltage and current, and checking the output voltage and current. Use an oscilloscope to monitor the output voltage and identify any noise or oscillations. Check the device's thermal performance and ensure that it is operating within the recommended temperature range. Consult the datasheet and application notes for specific troubleshooting guidelines.
  • Operating the device beyond the recommended operating conditions can lead to reduced performance, decreased reliability, and potentially even damage to the device. Exceeding the maximum ratings can cause the device to overheat, leading to thermal shutdown or permanent damage. Always ensure that the device operates within the recommended specifications.

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SI3139KDWA-TP Overview

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