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SI3415C-TP - MCC

Description: Small Signal MOSFETS

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PCB Footprints
SI3415C-TP - MCC PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SOT-23-ren20
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3D Models
SI3415C-TP - MCC  - 3D model - SOT23 (3-Pin) - SOT-23-ren20
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SI3415C-TP Details

  • Manufacturer Part Number:

    SI3415C-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    6

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    3.9 A

  • Drain-source On Resistance-Max:

    0.04 Ω

SI3415C-TP Frequently Asked Questions (FAQs)

  • A good PCB layout for the SI3415C-TP involves keeping the input and output traces short and separate, using a solid ground plane, and placing decoupling capacitors close to the device. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
  • To ensure proper biasing, make sure to connect the enable pin (EN) to a logic high (VCC) and the shutdown pin (SD) to a logic low (GND). Also, ensure that the input voltage (VIN) is within the recommended range of 2.7V to 5.5V.
  • The maximum output current capability of the SI3415C-TP is 1.5A. However, it's recommended to derate the output current based on the ambient temperature and the PCB layout to ensure reliable operation.
  • To protect the SI3415C-TP from overvoltage and undervoltage conditions, use a voltage supervisor or a reset IC to monitor the input voltage and shut down the device if it exceeds the recommended range. Additionally, consider using a TVS diode or a zener diode to clamp the input voltage.
  • The thermal resistance of the SI3415C-TP package is typically around 30°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 30°C above the ambient temperature.

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SI3415C-TP Overview

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