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SI3420-TP - MCC

Description: Small Signal MOSFETS

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SI3420-TP Details

  • Manufacturer Part Number:

    SI3420-TP

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    SOT-23, 3 PIN

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Manufacturer:

    Micro Commercial Components

  • YTEOL:

    0

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    6 A

  • Drain-source On Resistance-Max:

    0.027 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    137 pF

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    0.35 W

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

SI3420-TP Frequently Asked Questions (FAQs)

  • A good PCB layout for the SI3420-TP should ensure that the input and output pins are separated, and the input pins are connected to a low-impedance source. Additionally, the PCB should have a solid ground plane and a low-inductance path for the output current. A 4-layer PCB with a dedicated power plane and a separate ground plane is recommended.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices. This includes providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device. Additionally, the device should be operated within its recommended temperature range, and the junction temperature should be monitored to prevent overheating.
  • The SI3420-TP has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and testing. This includes using ESD-safe materials, grounding personnel and equipment, and minimizing the risk of static electricity discharge. Additionally, the device should be connected to a low-impedance source and a solid ground plane to ensure effective ESD protection.
  • Yes, the SI3420-TP can be used in parallel to increase the output current. However, it's essential to ensure that the devices are properly synchronized and that the output currents are balanced. Additionally, the PCB layout should be designed to minimize the inductance and resistance of the output traces, and the devices should be connected to a low-impedance source.
  • The recommended input capacitor value for the SI3420-TP depends on the input voltage and the desired output ripple. A general guideline is to use a capacitor with a value of at least 10uF and a voltage rating of at least 1.5 times the input voltage. The capacitor should also have a low ESR and be placed close to the input pins of the device.

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SI3420-TP Overview

Use the download button to access the SI3420-TP 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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