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SI3437DV-T1-GE3 - Vishay

Description: Vishay SI3437DV-T1-GE3 P-channel MOSFET Transistor, 1.1 A, 150 V, 6-Pin TSOP

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PCB Footprints
SI3437DV-T1-GE3 - Vishay PCB footprint - SOT23 (6-Pin) - SOT23 (6-Pin) - 6-LEAD TSOP
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3D Models
SI3437DV-T1-GE3 - Vishay  - 3D model - SOT23 (6-Pin) - 6-LEAD TSOP
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SI3437DV-T1-GE3 Details

  • Manufacturer Part Number:

    SI3437DV-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MO-193C, TSOP-6

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    1.25 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    150 V

  • Drain Current-Max (ID):

    1.4 A

  • Drain-source On Resistance-Max:

    0.75 Ω

  • FET Technology:

    TRENCH MOSFET

  • Feedback Cap-Max (Crss):

    21 pF

  • JEDEC-95 Code:

    MO-193AA

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    3.2 W

  • Pulsed Drain Current-Max (IDM):

    5 A

  • Qualification Status:

    Not Qualified

  • Reference Standard:

    IEC-61249-2-21

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    56 ns

  • Turn-on Time-Max (ton):

    65 ns

SI3437DV-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI3437DV-T1-GE3 is a 3-pin SOT23 package with a 1.3mm x 1.3mm body size. A minimum pad size of 0.6mm x 0.6mm is recommended for each pin.
  • To ensure proper soldering, use a soldering iron with a temperature of 260°C (500°F) and a solder with a melting point of 220°C (428°F). Apply a small amount of solder to the pads and reflow according to the recommended soldering profile.
  • The SI3437DV-T1-GE3 has an operating temperature range of -40°C to 125°C (-40°F to 257°F). However, it's recommended to operate within -20°C to 85°C (-4°F to 185°F) for optimal performance.
  • The SI3437DV-T1-GE3 has built-in ESD protection, but it's still recommended to follow standard ESD handling procedures, such as using an ESD wrist strap or mat, and storing the devices in anti-static packaging.
  • Store the SI3437DV-T1-GE3 in a dry, cool place with a temperature range of 5°C to 30°C (41°F to 86°F) and relative humidity below 60%. Avoid exposing the devices to direct sunlight, moisture, or extreme temperatures.

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