The recommended PCB footprint for the SI4126DY-T1-GE3 is a 2x2mm QFN package with a 0.5mm pitch. A minimum of 4 layers is recommended for optimal thermal performance.
To ensure the device operates within the specified junction temperature range, ensure proper thermal design, including a heat sink or thermal pad, and follow the recommended PCB layout guidelines.
The maximum allowed voltage on the VIN pin is 5.5V. Exceeding this voltage may damage the device.
The SI4126DY-T1-GE3 is rated for operation up to 125°C. However, for high-temperature environments, consider using a device with a higher temperature rating or implementing additional thermal management.
Check the input voltage, ensure proper PCB layout, and verify the enable pin is properly biased. Also, check for any short circuits or excessive current draw.
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SI4126DY-T1-GE3 Overview
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