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SI4840BDY-T1-E3 - Vishay

Description: MOSFET 40V Vds 20V Vgs SO-8

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SI4840BDY-T1-E3 - Vishay PCB footprint - Small Outline Packages - Small Outline Packages - SOIC (NARROW): 8-LEA
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SI4840BDY-T1-E3 - Vishay  - 3D model - Small Outline Packages - SOIC (NARROW): 8-LEA
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SI4840BDY-T1-E3 Details

  • Manufacturer Part Number:

    SI4840BDY-T1-E3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    MS-012, SOIC, SOP-8

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    11 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    40 V

  • Drain Current-Max (ID):

    19 A

  • Drain-source On Resistance-Max:

    0.009 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    150 pF

  • JEDEC-95 Code:

    MS-012AA

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    6 W

  • Pulsed Drain Current-Max (IDM):

    50 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    40

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    55 ns

  • Turn-on Time-Max (ton):

    60 ns

SI4840BDY-T1-E3 Frequently Asked Questions (FAQs)

  • A good PCB layout for the SI4840BDY-T1-E3 involves keeping the input and output traces as short as possible, using a solid ground plane, and minimizing the distance between the device and the decoupling capacitors. A 4-layer PCB with a dedicated ground plane is recommended.
  • To ensure proper biasing, connect the VCC pin to a stable voltage source (e.g., 3.3V or 5V) and decouple it with a 10uF capacitor to ground. The EN pin should be tied to VCC or a digital signal for enable/disable functionality.
  • The SI4840BDY-T1-E3 can operate up to 100 MHz, but the maximum frequency is dependent on the specific application and PCB layout. It's recommended to consult the datasheet and application notes for more information.
  • The SI4840BDY-T1-E3 has built-in ESD protection, but it's still recommended to follow proper ESD handling procedures during assembly and testing. Use an ESD wrist strap or mat, and ensure that the device is stored in an ESD-safe environment.
  • The thermal resistance of the SI4840BDY-T1-E3 package is typically around 30°C/W. This value can vary depending on the specific application and PCB design. Consult the datasheet and thermal management guidelines for more information.

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SI4840BDY-T1-E3 Overview

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