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MBRM140T3G
onsemi
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1 | Low Profile - Maximum Height of 1.1 mm; Small Footprint - Footprint Area of 8.45 mm2; Low VF Provides Higher Efficiency and Extends Battery Life; Supplied in 12 mm Tape and Reel; Low Thermal Resistance with Direct Thermal Path of Die on Exposed Cathode Heat Sink Mechanical Characteristics:; Powermite is JEDEC Registered as DO-216AA; Case: Molded Epoxy; Epoxy Meets UL94V-0 at 1/8"; Weight: 62 mg (approximately); Device Marking: BCJ; Lead and Mounting Surface Temperature for Soldering Purposes. 260°C Maximum | Other | MBRM140T3G |
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![Part Image](["https://www.onsemi.com/PowerSolutions/product.do?id=MBRM140T3G","https://www.onsemi.com/PowerSolutions/product.do?id=MBRM140T3G","//content.supplyframe.com/images/process/fit-in/100x100/p/do216_2.jpg"])
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