HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, 1212-8, POWERPAK-8
ECCN Code:
EAR99
Factory Lead Time:
15 Weeks
Manufacturer:
Vishay Intertechnologies
YTEOL:
3
Case Connection:
DRAIN
Configuration:
SINGLE WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
12 V
Drain Current-Max (ID):
26.1 A
Drain-source On Resistance-Max:
0.0037 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JESD-30 Code:
S-XDSO-C5
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
1
Number of Terminals:
5
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
UNSPECIFIED
Package Shape:
SQUARE
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
52 W
Pulsed Drain Current-Max (IDM):
60 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
C BEND
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
SI7104DN-T1-GE3 Frequently Asked Questions (FAQs)
A good PCB layout for optimal thermal performance involves placing thermal vias under the package, using a solid ground plane, and keeping the thermal path as short as possible. A 4-layer PCB with a dedicated thermal layer is recommended.
To ensure reliable operation in high-temperature environments, ensure proper heat sinking, use a thermally conductive interface material, and follow the recommended derating guidelines for the device. Additionally, consider using a thermal interface material with a high thermal conductivity.
Exceeding the maximum junction temperature (Tj) rating can lead to reduced device lifespan, increased thermal resistance, and potentially catastrophic failure. It's essential to ensure that the device operates within the recommended temperature range to maintain reliability and performance.
To handle ESD protection, follow proper handling and storage procedures, use ESD-protective packaging, and implement ESD protection circuits in the design. The device has an internal ESD protection diode, but additional external protection may be necessary depending on the application.
When paralleling multiple devices, ensure that each device has its own heat sink, and the devices are matched for optimal performance. Additionally, consider the current sharing and thermal management implications, and ensure that the total current rating is not exceeded.
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SI7104DN-T1-GE3 Overview
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