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SI7119DN-T1-GE3 - Vishay

Description: P-Ch PowerPAK 1212-8 200V 1050mohm @ 10

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SI7119DN-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK 1212-8 Single_2
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SI7119DN-T1-GE3 - Vishay  - 3D model - Other - PowerPAK 1212-8 Single_2
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SI7119DN-T1-GE3 Details

  • Manufacturer Part Number:

    SI7119DN-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, 1212-8, POWERPAK-8

  • Country Of Origin:

    Israel

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6

  • Avalanche Energy Rating (Eas):

    1.25 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    200 V

  • Drain Current-Max (ID):

    1.2 A

  • Drain-source On Resistance-Max:

    1.1 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    S-XDSO-C5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    52 W

  • Pulsed Drain Current-Max (IDM):

    5 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI7119DN-T1-GE3 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the SI7119DN-T1-GE3 is a 5x5 mm QFN package with a 0.5 mm pitch. A thermal pad is recommended for optimal thermal performance.
  • To ensure proper soldering, use a reflow soldering process with a peak temperature of 260°C (500°F) for 10-30 seconds. Avoid using wave soldering or hand soldering, as it may damage the device.
  • The SI7119DN-T1-GE3 is rated for operation from -40°C to 150°C (TJ). However, for optimal performance and reliability, it's recommended to operate within the -20°C to 125°C range.
  • The SI7119DN-T1-GE3 is not hermetically sealed, so it's not recommended for use in high-humidity environments. If you must use it in such an environment, ensure proper conformal coating and follow IPC-J-STD-001 guidelines for moisture-sensitive devices.
  • Handle the SI7119DN-T1-GE3 with ESD-protective equipment, such as wrist straps, mats, and bags. Ensure the workspace is ESD-safe, and avoid touching the device's pins or exposed die.

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SI7119DN-T1-GE3 Overview

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