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SI7135DP-T1-GE3 - Vishay

Description: VISHAY - SI7135DP-T1-GE3 - MOSFET, P-CH, -30V, -60A, POWERPAK SO

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PCB Footprints
SI7135DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_111
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3D Models
SI7135DP-T1-GE3 - Vishay  - 3D model - Other - PowerPAK® SO-8 Single_111
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SI7135DP-T1-GE3 Details

  • Manufacturer Part Number:

    SI7135DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOFEN FREE AND ROHS COMPLIANT, LEADLESS, POWERPAK, SOP-8

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    80 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    30 V

  • Drain Current-Max (ID):

    31.6 A

  • Drain-source On Resistance-Max:

    0.0039 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XDSO-C5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    104 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI7135DP-T1-GE3 Frequently Asked Questions (FAQs)

  • A recommended PCB layout for optimal thermal performance would be to have a large copper area connected to the thermal pad, with multiple vias to dissipate heat. A minimum of 2 oz copper thickness is recommended.
  • To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C. Apply a small amount of solder paste to the pads and use a reflow oven or a hot air gun to solder the device. Avoid overheating the device.
  • The maximum allowed voltage on the gate pin is 20V. Exceeding this voltage may damage the device.
  • To protect the device from ESD, handle the device by the body or use an anti-static wrist strap. Use an ESD-safe workstation and ensure all tools and equipment are grounded.
  • The recommended operating frequency range for the SI7135DP-T1-GE3 is up to 100 kHz. Operating the device above this frequency may reduce its performance and reliability.

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SI7135DP-T1-GE3 Overview

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