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SI7141DP-T1-GE3 - Vishay

Description: VISHAY - SI7141DP-T1-GE3 - MOSFET, P CH, -20V, -60A, POWERPAK SO

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SI7141DP-T1-GE3 - Vishay PCB footprint - Other - Other - PowerPAK® SO-8 Single_1
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SI7141DP-T1-GE3 - Vishay  - 3D model - Other - PowerPAK® SO-8 Single_1
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SI7141DP-T1-GE3 Details

  • Manufacturer Part Number:

    SI7141DP-T1-GE3

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    HALOGEN FREE AND ROHS COMPLIANT, LEADLESS, POWERPAK, SOP-8

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    15 Weeks

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    5.3

  • Avalanche Energy Rating (Eas):

    80 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    20 V

  • Drain Current-Max (ID):

    60 A

  • Drain-source On Resistance-Max:

    0.0019 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-XDSO-C5

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    5

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    104 W

  • Pulsed Drain Current-Max (IDM):

    100 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    C BEND

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

SI7141DP-T1-GE3 Frequently Asked Questions (FAQs)

  • A thermal pad on the bottom of the package should be connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 2 oz copper thickness is recommended.
  • The device requires a stable voltage supply and a bias circuit to ensure proper operation. A voltage regulator and decoupling capacitors should be used to minimize noise and voltage fluctuations.
  • The maximum power dissipation for the SI7141DP-T1-GE3 is 1.4 W. Exceeding this limit may cause the device to overheat and reduce its lifespan.
  • Yes, the SI7141DP-T1-GE3 is qualified for automotive and high-reliability applications. However, additional testing and validation may be required to meet specific industry standards.
  • The SI7141DP-T1-GE3 has built-in ESD protection, but additional external protection measures such as TVS diodes or ESD arrays may be necessary to ensure robustness against electrostatic discharge.

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SI7141DP-T1-GE3 Overview

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